Intel® Server Board M50FCP2SBSTD
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel® Server Board M50FCP
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Code Name
Products formerly Fox Creek Pass
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Marketing Status
Discontinued
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Launch Date
Q1'23
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Expected Discontinuance
2023
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EOL Announce
Friday, May 5, 2023
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Last Order
Friday, June 30, 2023
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Limited 3-year Warranty
Yes
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Extended Warranty Available for Purchase (Select Countries)
Yes
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Additional Extended Warranty Details
Dual Processor Board Extended Warranty
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Compatible Product Series
4th Gen Intel® Xeon® Scalable Processors, 5th Gen Intel® Xeon® Scalable Processors
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Board Form Factor
18.79” x 16.84”
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Chassis Form Factor
Rack
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Socket
Socket-E LGA4677
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Integrated BMC with IPMI
IPMI 2.0 & Redfish
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Rack-Friendly Board
Yes
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TDP
350 W
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Included Items
(5) Intel® Server Board M50FCP2SBSTD
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Board Chipset
Intel® C741 Chipset
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Target Market
Mainstream
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Supplemental Information
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Embedded Options Available
No
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Description
Spreadcore form factor board supporting two Xeon® SP 350W TDP processors,
16 DIMMs w/ 8x Intel® Optane™ PMM capable DIMMs per CPU.
Memory Specifications
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Max Memory Size (dependent on memory type)
12 TB
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Memory Types
• DDR5 (RDIMM)
• 3DS-RDIMM
• 9x4 RDIMM
• Intel® Optane™ PMem 300 series
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Max # of Memory Channels
16
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Max Memory Bandwidth
4800 GB/s
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# of Memory Slots
32
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ECC Memory Supported ‡
Yes
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Intel® Optane™ Persistent Memory Supported
Yes
GPU Specifications
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Integrated Graphics ‡
Yes
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Graphics Output
VGA
Expansion Options
I/O Specifications
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Open Compute Port (OCP) Support
1 x 3.0
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# of USB Ports
5
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USB Configuration
• One USB 3.0 port at back panel
• Two USB 2.0 ports at back panel
• One USB 3.0 port front panel
• One USB 2.0 port front panel
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USB Revision
2.0 & 3.0
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Total # of SATA Ports
10
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Max # of UPI Links
3
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# of Serial Ports
1
Package Specifications
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Max CPU Configuration
2
Advanced Technologies
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Advanced System Management key
Yes
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Intel® Optane™ Memory Supported ‡
Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
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Intel® Remote Management Module Support
Yes
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Intel® Node Manager
Yes
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TPM Version
2.0
Security & Reliability
Ordering and Compliance
Compatible Products
5th Gen Intel® Xeon® Scalable Processors
4th Gen Intel® Xeon® Scalable Processors
Intel® Server M50FCP Family
Intel® RAID Backup (Batteries/Flash)
Intel® RAID Controllers
Heat-Sink Options
Spare Cable Options
Spare Fan Options
Spare Heat-Sink Options
Spare Power Options
100GbE Intel® Ethernet Network Adapter E810
25GbE Intel® Ethernet Network Adapter E810
Intel® Ethernet Network Adapter X710
Drivers and Software
Description
Type
More
OS
Version
Date
All
View Details
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Latest Drivers & Software
Name
BIOS and Firmware Update Package for UEFI for Intel® Server M50FCP Family
BIOS and System Firmware Update Package (SFUP) for Windows* and Linux* for Intel® Server M50FCP Family
Onboard Video Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 741 Chipset
Onboard Video Driver for Linux* for Intel® Server Boards and Systems Based on Intel® 741 Chipset
Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 741 Chipset
Intel® Virtual RAID on CPU (Intel® VROC) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 741 Chipset
Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems
Server Information Retrieval Utility (SysInfo) for Intel® Server Boards and Intel® Server Systems
Server Firmware Update Utility(SysFwUpdt) for Intel® Server Boards and Intel® Server Systems
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Intel® Optane™ Persistent Memory Supported
Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance. Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
Max # of UPI Links
Intel® Ultra Path Interconnect (UPI) links are a high speed, point-to-point interconnect bus between the processors, delivering increased bandwidth and performance over Intel® QPI.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.