Intel® Compute Module MFS5000SI
Specifications
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Essentials
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Product Collection
Intel® Compute Module MFS5000SI Family
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Code Name
Products formerly Sauvie Island
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Marketing Status
Discontinued
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Launch Date
Q4'08
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Expected Discontinuance
Q2'10
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EOL Announce
Friday, April 2, 2010
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Last Order
Friday, November 5, 2010
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Last Receipt Attributes
Friday, April 1, 2011
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Limited 3-year Warranty
Yes
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Board Form Factor
1U
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Chassis Form Factor
Rack or Pedestal
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TDP
80 W
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Board Chipset
Intel® 5000P Memory Controller
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Supplemental Information
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Embedded Options Available
No
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Description
Intel(R) Modular Server Compute Module
Memory Specifications
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Max Memory Size (dependent on memory type)
31.25 GB
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Memory Types
FBDDR2 800
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Max # of Memory Channels
2
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Max Memory Bandwidth
1066 GB/s
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# of Memory Slots
8
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ECC Memory Supported ‡
Yes
GPU Specifications
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Integrated Graphics ‡
Yes
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Graphics Output
Front Panel 15-pin
I/O Specifications
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# of USB Ports
2
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USB Revision
2.0
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Integrated LAN
Intel® 82563EB Gigabit Ethernet Controller
Package Specifications
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Max CPU Configuration
2
Ordering and Compliance
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Retired and discontinued
Trade compliance information
- ECCN 5A992C
- CCATS G135162
- US HTS 8473301180
Compatible Products
I/O Options
Intel® Modular Server Chassis Family
Drivers and Software
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Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.