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  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® Compute Module MFS2600KI

Specifications

Export specifications

Essentials

  • Product Collection Intel® Compute Module MFS2600KI Family
  • Marketing Status Discontinued
  • Launch Date Q3'12
  • Expected Discontinuance Q1'13
  • EOL Announce Sunday, March 31, 2013
  • Last Order Friday, November 1, 2013
  • Last Receipt Attributes Sunday, March 30, 2014
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • # of QPI Links 2
  • Compatible Product Series Intel(r) Xeon Processor E5-2600 Series
  • Board Form Factor 1U, custom for Intel Modular Server
  • Chassis Form Factor Pedestal, 6U Rack Option
  • Socket Socket R
  • Integrated BMC with IPMI IPMI 2.0
  • TDP 95 W
  • Included Items (1) Intel Compute Module MFS2600KI based on the Intel Xeon Processor E5-2600 processor and Intel® C602-J Chipset (PCH). Supports up to two E5-2600 CPUs (up to 95W TDP), 16 DIMMs DDR3 memory, two 1Gb Ethernet ports, and an optional 2-port 1Gb Ethernet mezzanine card. Also comes with (2) CPU heat sinks.
  • Board Chipset Intel® C602 Chipset
  • Target Market Small and Medium Business

Supplemental Information

  • Embedded Options Available No
  • Description Intel Compute Module based on the Intel Xeon Processor E5-2600 processor (up to 95W TDP) and Intel® C602-J Chipset (PCH). Supports up to two E5-2600 CPUs, 16 DIMMs DDR3 memory, two 1Gb Ethernet ports, and an optional 2-port 1Gb Ethernet mezzanine card.

Memory Specifications

GPU Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Ordering and Compliance

Retired and discontinued

Intel® Compute Module MFS2600KI, Single

Intel® Compute Module MFS2600KIB, 3 Pack

Trade compliance information

  • ECCN 5A992C
  • CCATS G145323
  • US HTS 8473305100

Compatible Products

Intel® Xeon® Processor E5 Family

Product Name Launch Date Total Cores Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon® Processor E5-2603 Q1'12 4 1.80 GHz 10 MB Intel® Smart Cache 80 W 2903
Intel® Xeon® Processor E5-2609 Q1'12 4 2.40 GHz 10 MB Intel® Smart Cache 80 W 2953
Intel® Xeon® Processor E5-2620 Q1'12 6 2.50 GHz 2.00 GHz 15 MB Intel® Smart Cache 95 W 2998
Intel® Xeon® Processor E5-2630 Q1'12 6 2.80 GHz 2.30 GHz 15 MB Intel® Smart Cache 95 W 3086
Intel® Xeon® Processor E5-2630L Q1'12 6 2.50 GHz 2.00 GHz 15 MB Intel® Smart Cache 60 W 3119
Intel® Xeon® Processor E5-2640 Q1'12 6 3.00 GHz 2.50 GHz 15 MB Intel® Smart Cache 95 W 3175
Intel® Xeon® Processor E5-2650 Q1'12 8 2.80 GHz 2.00 GHz 20 MB Intel® Smart Cache 95 W 3218
Intel® Xeon® Processor E5-2650L Q1'12 8 2.30 GHz 1.80 GHz 20 MB Intel® Smart Cache 70 W 3229
Intel® Xeon® Processor E5-2660 Q1'12 8 3.00 GHz 2.20 GHz 20 MB Intel® Smart Cache 95 W 3245

I/O Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Dual Gigabit Ethernet I/O Expansion Mezzanine Card AXXGBIOMEZV Q4'07 Discontinued 64397

Intel® Server Component Extended Warranty

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Intel® Modular Server Compute Module Extended Warranty Q2'11 Discontinued 65461

Intel® Modular Server Chassis Family

Product Name Launch Date Marketing Status Chassis Form Factor Sort Order Compare
All | None
Intel® Modular Server Chassis MFSYS25V2 Q1'11 Discontinued Pedestal, 6U Rack Option 67146

Intel® Data Center Manager

Compare
All | None

Drivers and Software

Latest Drivers & Software

Downloads Available:
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Name

Onboard Network Driver for Linux*

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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

# of QPI Links

QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe x8 Gen 2.x

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of LAN Ports

LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Embedded USB (eUSB) Solid State Drive Option

Embedded USB (Universal Serial Bus) supports small USB flash storage devices which can be plugged directly into the board, and can be used for mass storage or a boot device.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.