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  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® Server System VRN2224THY2

Specifications

Export specifications

Essentials

  • Product Collection Intel® Data Center Blocks for Cloud (Intel® DCB for Cloud)
  • Code Name Products formerly Taylor Pass
  • Launch Date Q1'16
  • Marketing Status Discontinued
  • Expected Discontinuance Q1'18
  • EOL Announce Friday, January 26, 2018
  • Last Order Friday, January 26, 2018
  • Last Receipt Attributes Friday, January 26, 2018
  • Limited 3-year Warranty Yes
  • ISV Certification Designed for VMware* Virtual SAN (VSAN)
  • Chassis Form Factor 2U, 4 node Rack Chassis
  • Chassis Dimensions 17.24'' x 28.86'' x 3.42''
  • Board Form Factor Custom 6.8" x 18.9"
  • Compatible Product Series Intel® Xeon® Processor E5-2600 v4 Family
  • Socket Socket R3
  • Heat Sink 8 (4x2)
  • Heat Sink Included Yes
  • System Board Intel® Server Board S2600TPR
  • Board Chipset Intel® C612 Chipset
  • Target Market Cloud/Datacenter
  • Rack-Friendly Board Yes
  • Power Supply 1600 W
  • Power Supply Type AC
  • # of Power Supply Included 2
  • Redundant Fans No
  • Redundant Power Supported Yes
  • Backplanes Included
  • Included Items Intel® Server Chassis H2224XXKR2, Intel® Compute Module HNS2600TP24SR (x4), Intel® Xeon® Processor E5-2620 v4 (x8), Intel® SSD DC S3710 2.5" 200GB (x4), SATADOM 32GB (x4), Remote Management Module 4 Lite 2 (x4), 16GB DDR 288-pin (x8) See PCN 115385-00

Supplemental Information

  • Description Cloud Block – VMware vSAN Ready Node includes Intel® Server Board, Chassis, Xeon® E5 Processors, Intel® Solid State Drives (SSDs) and third-party memory, configurations optimized and pre-certified for VMware VSAN.

Memory & Storage

GPU Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 8

Compatible Products

Intel® Xeon® Processor E5 v4 Family

Product Name Launch Date Total Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon® Processor E5-2620 v4 Q1'16 8 3.00 GHz 2.10 GHz 20 MB Intel® Smart Cache 85 W 2281

Intel® Compute Module HNS2600TP Family

Compare
All | None

Bezel Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
2U Bezel A2UBEZEL Q2'12 Discontinued 64019

Management Module Options

Compare
All | None

Rail Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
2/4U Premium Rail AXXFULLRAIL (with CMA support) Q2'15 Launched 64573
Enhanced Value RAIL AXXELVRAIL Q3'12 Launched 64629

Spare Board Options

Compare
All | None

Spare Chassis Control Panel Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Spare Front Control Panel Kit FH2000FPANEL2 Q4'14 Launched 64973

Spare Drive Bays & Carrier Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
2.5 inch Hot-swap Drive Carrier FXX25HSCAR2 Q3'14 Discontinued 65064
Spare 12GB SAS 24 x 2.5’’ Backplane FHW24X25HS12G Q3'15 Discontinued 65142

Spare Power Options

Compare
All | None

Intel® Server Component Extended Warranty

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Extended Warranty for Server Products for Cloud Q2'16 Discontinued 65457

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Intel® Server Board S2600TP Family Firmware Update Package for EFI

View Details

Intel® Configuration Detector for Linux*

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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

ISV Certification

ISV Certification indicates that the product has been pre-certified by Intel for the specified Independent Software Vendor software.

Storage Profile

Hybrid Storage profiles are a combination of either SATA Solid State Drives (SSDs) or NVMe SSDs and Hard Disk Drives (HDDs). All-Flash storage profiles are a combination of NMVe* SSDs and SATA SSDs.

Included Memory

Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

PCIe x8 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

# of LAN Ports

LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology

Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® Build Assurance Technology

Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Matrix Storage Technology

Intel® Matrix Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Predecessor to Intel® Rapid Storage Technology

Intel® Quiet System Technology

Intel® Quiet System Technology can help reduce system noise and heat through more intelligent fan speed control algorithms.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® I/O Acceleration Technology

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.