Intel® Server System LADMP2312KXXX41

Specifications

  • Product Collection Intel® Server System LADMP00AP Family
  • Code Name Products formerly Adams Pass
  • Launch Date Q2'16
  • Marketing Status Discontinued
  • Expected Discontinuance Q2'18
  • EOL Announce Monday, April 30, 2018
  • Last Order Sunday, September 30, 2018
  • Last Receipt Attributes Sunday, December 30, 2018
  • Limited 3-year Warranty Yes
  • Chassis Form Factor 2U Rack
  • Chassis Dimensions 17.24" x 30.35" x 3.42"
  • Board Form Factor Custom 6.8" x 14.2"
  • Rack Rails Included Yes
  • Socket LGA 3647-1
  • Heat Sink Included Yes
  • System Board Intel® Compute Module HNS7200AP
  • Board Chipset Intel® C612 Chipset
  • Target Market High Performance Computing
  • Power Supply 2130 W
  • Power Supply Type AC
  • # of Power Supply Included 2
  • Redundant Fans No
  • Redundant Power Supported Yes
  • Backplanes Included
  • Included Items (1) Intel® Server Chassis H2312XXLR2; (4) Intel® Compute Module HNS7200AP; (4) Intel® Xeon Phi™ Processor 7250; (24) 16GB (1x16GB) RDIMM, DDR4, Dual Rank, 2400Mhz; (4) Intel® Omni-Path Host Fabric Interface Adapter 100 Series 1 Port PCIe x16; (4) Remote Management Module AXXRMM4LITE

Supplemental Information

  • Description Pre-configured systems with Intel Compute Block, featuring 4 HNS7200AP with Intel® Xeon Phi™ Processor and Intel® Omni-Path Host Fabric Interface Adapter

Memory & Storage

GPU Specifications

Expansion Options

  • Riser Slot 1: Total # of Lanes 16
  • Riser Slot 2: Total # of Lanes 16

I/O Specifications

Package Specifications

  • Max CPU Configuration 4

Ordering and Compliance

Retired and discontinued

Intel® Server System LADMP2312KXXX41, Single

Trade compliance information

  • ECCN 5A002U
  • CCATS G157815L1
  • US HTS 8471500150

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

# of LAN Ports

LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology

Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® Build Assurance Technology

Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® Rapid Storage Technology enterprise

Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

Intel® Quiet System Technology

Intel® Quiet System Technology can help reduce system noise and heat through more intelligent fan speed control algorithms.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® I/O Acceleration Technology

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.